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Description of the board for a homemade flipper zero and instructions for assembling it

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FCFZ-FullLCD

Full-featured DIY Flipper Zero clone with an LCD display.

πŸ“Έ Hardware Overview

PCB Top View

PCB Bottom View


πŸ’Ύ Firmware & Software

πŸš€ Looking for the code? You can find the compiled binaries, source code, and flashing instructions in my github: πŸ‘‰ Download Firmware Here )


πŸ“‹ Bill of Materials (BOM)

🧠 Core Controller & Wireless Modules

  • STM32WB55CGU6 (WeAct Studio Dev Board)
    • The main brain of the device, handling processing, Bluetooth capabilities, and system logic.
  • E07-400MM10S
    • High-performance 10mW RF radio module operating in the sub-GHz spectrum.
  • ANT (Spring Antenna)
    • Dedicated helical spring antenna fine-tuned for the E07 wireless transceiver module.

πŸ“Ί Display & User Interface

  • LCD 1.4" ST7567
    • Central graphical display unit with a crisp 128x64 resolution for real-time menu navigation.
  • 4x4x0.5mm Tactile Buttons (6 pieces)
    • Low-profile SMD input switches mapped to hardware navigation (UP, DOWN, LEFT, RIGHT, OK, BACK).
  • 5050 RGB LED
    • Multi-color status indicator for background notifications, system logs, and operation status.

πŸ”Œ Power Management & Logic ICs

  • MCP23017
    • 16-bit I2C I/O port expander dedicated to driving tactile buttons, the RGB LED, and the haptic motor.
  • TP4056
    • Linear Li-Ion battery charger IC configured to safely manage internal battery replenishment.
  • MT3608
    • High-efficiency step-up (boost) DC-DC converter regulating stable voltage overheads directly from the Li-Po battery.
  • MAX16054
    • Pushbutton on/off controller featuring debounce circuitry, mapped directly to the BACK button for power states.
  • SN74LVC1G32DBVR
    • 2-input positive-OR gate, engineered to handle hardware system resets upon holding down the LEFT + BACK keys simultaneously.
  • MCP6002
    • Low-noise operational amplifier driving signal filtration for the integrated 125kHz RFID module.

πŸ› οΈ Hardware Interfaces & Peripherals

  • USB Type-C 16-Pin
    • Modern, heavy-duty surface mount receptacle facilitating wired data transfer, flashing, and device charging.
  • Micro SD Card Reader (SMD)
    • Compact surface-mount flash memory socket used for reading/writing local system assets, logs, and dumps.
  • Buzzer 9032 (Passive)
    • Piezoelectric passive sounder responsible for delivering audible signals, sound effects, and UI chirps.
  • IR LED & IR Receiver
    • Dedicated optical pairing for capturing, capturing dumps, and playing back Infrared remote control protocols.
  • 2.54mm Pin Headers (1x10 & 1x8)
    • External GPIO breaking-out terminal rails allowing effortless hardware hacking and modular expansion.

πŸ”Œ Active Semiconductors (Transistors)

⚠️ Note: All transistors listed below must use the standard SOT-23 package.

Component Type Part Number Component Designators Quantity Technical Notes / Purpose
NPN Transistor J3Y Q1 1 High-current switch for the Infrared (IR) transmitter circuit
NPN Transistor 2TY Q2 1 Low-side driver for the passive audio buzzer gating
NPN Transistor S8050 Q3 1 High-speed switching transistor for 125kHz RFID tag emulation
P-Ch MOSFET A19T Q4, Q5 2 Power path routing for the 125kHz RFID module and MAX16054 power switch
N-Ch MOSFET A2SHB Q6 1 Low-side enhancement-mode driver for the haptic vibration motor

πŸ›‘ Active Semiconductors (Diodes)

Component Type Part Number Component Designators Quantity Technical Notes / Purpose
Switching Diode 1N4148 SMD U7, U9 2 High-speed isolation; one for 125kHz RFID, one protecting BACK key line to MCP23017
Protection Diode S4 D1, D2 2 High-current reverse protection for the Li-Po battery and USB Type-C rails
Schottky Diode SS34 U11 1 High-speed barrier rectifier matched for the MT3608 boost converter feedback loop

πŸ“‰ Passive Components (Resistors)

⚠️ Note: All resistors listed below must use the standard 0805 SMD package.

Component Type Value / Rating Component Designators Quantity Technical Notes
Power Inductor 22 uH L1 1 Power-optimized storage choke matched for the MT3608 boost circuit
0805 Resistor 0.1 Ohm R23 1 High-precision current-sensing shunt resistor
0805 Resistor 100 Ohm R3 1 Current limiting resistor
0805 Resistor 1 kOhm R1, R2, R17, R24 4 Pull-up / general signal limiting
0805 Resistor 2.2 kOhm R8, R19 2 Specialized signal conditioning bias
0805 Resistor 5.1 kOhm R6, R7 2 Configured for proper USB-C CC line detection
0805 Resistor 10 kOhm R4, R9, R10, R14, R15, R16, R22, R25, R28, U19 10 Universal digital pull-up/pull-down array
0805 Resistor 15 kOhm R20 1 Analog voltage divider / reference step
0805 Resistor 18 kOhm R21 1 System voltage sensing network bias
0805 Resistor 50 kOhm R5 1 High-ohm control loop biasing resistor
0805 Resistor 100 kOhm R11, R12, R13 3 High-impedance reference pull-down network

πŸ”‹ Passive Components (Capacitors)

⚠️ Note: All capacitors listed below must use the standard 0805 SMD package.

Component Type Value / Rating Component Designators Quantity Dielectric / Technical Requirements
0805 Capacitor 1 nF C3 1 Standard filtering ceramic capacitor
0805 Capacitor 3.3 nF C1 1 CRITICAL: Must strictly use C0G/NP0 ultra-stable dielectric!
0805 Capacitor 22 nF C2 1 Signal smoothing capacitor
0805 Capacitor 100 nF C4, C5, C6 3 Local high-frequency IC decoupling capacitors
0805 Capacitor 22 uF C10, C11 2 Main power rail bulk smoothing capacitors

πŸ› οΈ Step-by-Step PCBA Assembly Manual

For a flawless manual assembly, it is highly recommended to use premium flux, thin solder wire (or solder paste with a hot air rework station), and a pair of fine tweezers. Assemble components sequentially based on their physical profile from lowest to highest to avoid access blockages during soldering.

Phase 1: Micro SMD Passives (0805 Form Factor)

  • Step 1: Populate and reflow all 0805 SMD Resistors across the board. Double-check small values like the R23 (0.1 Ohm shunt) to ensure accuracy.
  • Step 2: Populate all 0805 SMD Capacitors.
    • ⚠️ CRITICAL WARNING: C1 (3.3nF) dictates the stability of your 125khz. You must utilize a high-quality 0805 C0G/NP0 rated capacitor here. Regular X7R/Y5V dielectrics will drift with temperature fluctuations and completely break radio communication reliability.

Phase 2: Structural Connector Breakouts

  • Step 3: Mount the 2.54mm Pin Headers (1x10 and 1x8). Use a breadboard as a leveling jig during soldering to ensure the pins remain perpendicular to the PCB surface.

Phase 3: Discrete Semiconductors

  • Step 4: Carefully solder all small-outline package transistors (Q1–Q6 in SOT-23) and SMD diodes (U7, U9, D1, D2, U11). Always verify correct cathode orientation utilizing the line marks indicated on the PCB silkscreen layout.

Phase 4: Core Interfacing Integrated Circuits

  • Step 5: Position and solder the MCP6002 operational amplifier and the MCP23017 port expander.
    • ⚠️ HARDWARE MODIFICATION REQUIRED: To match the firmware routing and correct port expander mapping, you must solder a physical wire jumper on the designated MCP23017 pins exactly as highlighted in the hardware reference photograph below:

Phase 5: High-Density External Interface Sockets

  • Step 6: Align and solder the 16-pin USB Type-C socket and the Micro SD Card Reader slot. Use plenty of flux on the Type-C signal pins to prevent bridging underneath the housing. Inspect the ground pads thoroughly for solid structural anchoring to the PCB.

Phase 6: Bulky Peripherals & Inductors

  • Step 7: Solder the large power Inductor (22uH) and the Passive Buzzer 9032. Ensure the buzzer sits flush against the board to prevent acoustic rattling inside the final enclosure shell.

Phase 7: Integrated Power & Logic Matrix

  • Step 8: Carefully solder the power management array and supporting logic units: TP4056 (charging), MT3608 (boost), SN74 (reset gate), INA219 (power monitor), and the MAX16054 (pushbutton module). Check for solder bridges between adjacent pins.

Phase 8: Optoelectronics & Infrared Network

  • Step 9: Fit the IR LED and the IR Receiver into their respective pins.
    • ⚠️ POST-SOLDER TRIMMING: Once the IR transmitter leads are successfully soldered, use flush cutters to trim the excess pins completely flush (under 0mm clearance) on the opposite side of the PCB. This step is necessary to clear out the mechanical footprint space for items mounted directly behind it.

Phase 9: Radio Communications Node

  • Step 10: Drop the E07-400MM10S Sub-GHz module onto its surface-mount castellated pads. Pre-tinning the PCB pads with solder before placing the module makes it much easier to bridge the connection cleanly. Finish by soldering the ANT spring antenna directly to its output pad.

Phase 10: Core Processing Brain Injection

  • Step 11: Align the WeAct STM32WB55CGU6 Development Board onto its pin rows. Solder all anchoring lines securely.
    • ⚠️ POST-SOLDER TRIMMING: Just like the IR transmitter node, use high-precision flush cutters to crop the remaining through-hole pins on the opposite side of the PCB completely flat against the solder joints. If these pins project outward, they will cause a physical collision and puncture the display panel.

Phase 11: Display Panel Integration

  • Step 12: Gently route and solder the 1.4-inch ST7567 LCD Display directly over the flat-trimmed base of the board. Remove the protective plastic film only after your final enclosure assembly is complete to avoid scratching the display surface.

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Description of the board for a homemade flipper zero and instructions for assembling it

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