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β οΈNote: All transistors listed below must use the standard SOT-23 package.
Component Type
Part Number
Component Designators
Quantity
Technical Notes / Purpose
NPN Transistor
J3Y
Q1
1
High-current switch for the Infrared (IR) transmitter circuit
NPN Transistor
2TY
Q2
1
Low-side driver for the passive audio buzzer gating
NPN Transistor
S8050
Q3
1
High-speed switching transistor for 125kHz RFID tag emulation
P-Ch MOSFET
A19T
Q4, Q5
2
Power path routing for the 125kHz RFID module and MAX16054 power switch
N-Ch MOSFET
A2SHB
Q6
1
Low-side enhancement-mode driver for the haptic vibration motor
π Active Semiconductors (Diodes)
Component Type
Part Number
Component Designators
Quantity
Technical Notes / Purpose
Switching Diode
1N4148 SMD
U7, U9
2
High-speed isolation; one for 125kHz RFID, one protecting BACK key line to MCP23017
Protection Diode
S4
D1, D2
2
High-current reverse protection for the Li-Po battery and USB Type-C rails
Schottky Diode
SS34
U11
1
High-speed barrier rectifier matched for the MT3608 boost converter feedback loop
π Passive Components (Resistors)
β οΈNote: All resistors listed below must use the standard 0805 SMD package.
Component Type
Value / Rating
Component Designators
Quantity
Technical Notes
Power Inductor
22 uH
L1
1
Power-optimized storage choke matched for the MT3608 boost circuit
0805 Resistor
0.1 Ohm
R23
1
High-precision current-sensing shunt resistor
0805 Resistor
100 Ohm
R3
1
Current limiting resistor
0805 Resistor
1 kOhm
R1, R2, R17, R24
4
Pull-up / general signal limiting
0805 Resistor
2.2 kOhm
R8, R19
2
Specialized signal conditioning bias
0805 Resistor
5.1 kOhm
R6, R7
2
Configured for proper USB-C CC line detection
0805 Resistor
10 kOhm
R4, R9, R10, R14, R15, R16, R22, R25, R28, U19
10
Universal digital pull-up/pull-down array
0805 Resistor
15 kOhm
R20
1
Analog voltage divider / reference step
0805 Resistor
18 kOhm
R21
1
System voltage sensing network bias
0805 Resistor
50 kOhm
R5
1
High-ohm control loop biasing resistor
0805 Resistor
100 kOhm
R11, R12, R13
3
High-impedance reference pull-down network
π Passive Components (Capacitors)
β οΈNote: All capacitors listed below must use the standard 0805 SMD package.
Component Type
Value / Rating
Component Designators
Quantity
Dielectric / Technical Requirements
0805 Capacitor
1 nF
C3
1
Standard filtering ceramic capacitor
0805 Capacitor
3.3 nF
C1
1
CRITICAL: Must strictly use C0G/NP0 ultra-stable dielectric!
0805 Capacitor
22 nF
C2
1
Signal smoothing capacitor
0805 Capacitor
100 nF
C4, C5, C6
3
Local high-frequency IC decoupling capacitors
0805 Capacitor
22 uF
C10, C11
2
Main power rail bulk smoothing capacitors
π οΈ Step-by-Step PCBA Assembly Manual
For a flawless manual assembly, it is highly recommended to use premium flux, thin solder wire (or solder paste with a hot air rework station), and a pair of fine tweezers. Assemble components sequentially based on their physical profile from lowest to highest to avoid access blockages during soldering.
Phase 1: Micro SMD Passives (0805 Form Factor)
Step 1: Populate and reflow all 0805 SMD Resistors across the board. Double-check small values like the R23 (0.1 Ohm shunt) to ensure accuracy.
Step 2: Populate all 0805 SMD Capacitors.
β οΈCRITICAL WARNING:C1 (3.3nF) dictates the stability of your 125khz. You must utilize a high-quality 0805 C0G/NP0 rated capacitor here. Regular X7R/Y5V dielectrics will drift with temperature fluctuations and completely break radio communication reliability.
Phase 2: Structural Connector Breakouts
Step 3: Mount the 2.54mm Pin Headers (1x10 and 1x8). Use a breadboard as a leveling jig during soldering to ensure the pins remain perpendicular to the PCB surface.
Phase 3: Discrete Semiconductors
Step 4: Carefully solder all small-outline package transistors (Q1βQ6 in SOT-23) and SMD diodes (U7, U9, D1, D2, U11). Always verify correct cathode orientation utilizing the line marks indicated on the PCB silkscreen layout.
Phase 4: Core Interfacing Integrated Circuits
Step 5: Position and solder the MCP6002 operational amplifier and the MCP23017 port expander.
β οΈHARDWARE MODIFICATION REQUIRED: To match the firmware routing and correct port expander mapping, you must solder a physical wire jumper on the designated MCP23017 pins exactly as highlighted in the hardware reference photograph below:
Phase 5: High-Density External Interface Sockets
Step 6: Align and solder the 16-pin USB Type-C socket and the Micro SD Card Reader slot. Use plenty of flux on the Type-C signal pins to prevent bridging underneath the housing. Inspect the ground pads thoroughly for solid structural anchoring to the PCB.
Phase 6: Bulky Peripherals & Inductors
Step 7: Solder the large power Inductor (22uH) and the Passive Buzzer 9032. Ensure the buzzer sits flush against the board to prevent acoustic rattling inside the final enclosure shell.
Phase 7: Integrated Power & Logic Matrix
Step 8: Carefully solder the power management array and supporting logic units: TP4056 (charging), MT3608 (boost), SN74 (reset gate), INA219 (power monitor), and the MAX16054 (pushbutton module). Check for solder bridges between adjacent pins.
Phase 8: Optoelectronics & Infrared Network
Step 9: Fit the IR LED and the IR Receiver into their respective pins.
β οΈPOST-SOLDER TRIMMING: Once the IR transmitter leads are successfully soldered, use flush cutters to trim the excess pins completely flush (under 0mm clearance) on the opposite side of the PCB. This step is necessary to clear out the mechanical footprint space for items mounted directly behind it.
Phase 9: Radio Communications Node
Step 10: Drop the E07-400MM10S Sub-GHz module onto its surface-mount castellated pads. Pre-tinning the PCB pads with solder before placing the module makes it much easier to bridge the connection cleanly. Finish by soldering the ANT spring antenna directly to its output pad.
Phase 10: Core Processing Brain Injection
Step 11: Align the WeAct STM32WB55CGU6 Development Board onto its pin rows. Solder all anchoring lines securely.
β οΈPOST-SOLDER TRIMMING: Just like the IR transmitter node, use high-precision flush cutters to crop the remaining through-hole pins on the opposite side of the PCB completely flat against the solder joints. If these pins project outward, they will cause a physical collision and puncture the display panel.
Phase 11: Display Panel Integration
Step 12: Gently route and solder the 1.4-inch ST7567 LCD Display directly over the flat-trimmed base of the board. Remove the protective plastic film only after your final enclosure assembly is complete to avoid scratching the display surface.
About
Description of the board for a homemade flipper zero and instructions for assembling it